DESIGN CAPABILITIES

• Thru Hole and SMT designs
• Layers: 2-50
• Blind and buried Vias
• Back Drilling
• Stitching Vias
• Fine Pitch (0.5 and 0.4mm) sockets
• Matched length/ Delay up to +/- 1mil
• Controlled impedance (+/-5% tolerance)
• Multiple Impedance on same layer
• Curved traces
• Board Thickness: 62- 250 mils
• Design up to 6 GHZ Boards
• High current up to 150A